Products

Advanced Semiconductor Packaging Automation

Innovation for

today's challenge

&

tomorrow's

technology

BGA/CSP Solder Ball Mount Automation

Model : AU-800

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The AU-800 is a fully automated ball-grid-array (BGA) & chip-scale-package (CSP) solder ball placement system. Developed for today’s challenge & tomorrow’s technology, the AU-800 supports a wide variety of BGA types & formats.

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With superb ability to handle large ball counts using proprietary techniques, the AU-800 offers increased throughput with high levels of uptime. Its unique solder ball handling design eliminates double ball and prevents damage to the solder balls.

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The AU-800 operates on a high-rigidity platform with high accuracy motion systems specially configured for highly repeatable and accurate placement. Coupled with vision-guide features, the AU-800 allows enhanced fine-pitch placement performance without the need to create special fiducial patterns ... thereby allowing vision-guided placement on all types of BGA formats including singulated packages as well as strip-based packages.

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Integrated with Pre- and Post-Inspection features, the AU-800 further ensures only quality products are released for down-stream processes.

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The AU-800 ball mount tooling comprises only few items ... allowing for package conversion time as short as 5 minutes while ensuring low tooling cost.

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With modular design, the AU-800, coupled with its substrate handling modules, can be easily configured with a wide range of reflow oven and/or cleaner to form an integrated solder ball attach line for high volume production.

Even if you're

on the right track,

you'll get run

over if you just

sit there.

WILL ROGERS

... contact us now

Blk 4010 Ang Mo Kio Ave 10 #07-09 TECHplace I Singapore 569626

Phone : 65-64556011

Fax : 65-62339174

Email :  mktg@aurigintech.com

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